Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Precios a partir de
90,69

Enlaces patrocinados

COMPARAR TODAS LAS TIENDAS WEB (2)

Descripción

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Description Descripción
Product Specifications Especificaciones del producto
Resultados relacionados Resultados relacionados
Next
Previous

Comparar tiendas web (2)

Enlaces patrocinados · Algunas tiendas nos pagan una remuneración

Ordenar por:

90,69 €

90,69 €

Descripción (0)

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Especificaciones del producto

Marca Independently Published
EAN
  • 9798189958878

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

11,56 €
Comparar 2 tiendas 2 tiendas

CRC Press

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

183,03 €
Comparar 2 tiendas 2 tiendas

Independently Published

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and...

17,60 €
Comparar 2 tiendas 2 tiendas

Independently Published

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and...

24,08 €
Comparar 2 tiendas 2 tiendas
Elección Destacada
90,69 €
Ver oferta