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Páginas: 522, Edición: 1st edition 2021, Tapa blanda, Springer Nature B.V.
ICON Group International, Inc.
The 2027-2032 World Outlook for Semiconductor Advanced Packaging
The 2027-2032 World Outlook for Advanced Semiconductor Packaging
The 2027-2032 World Outlook for Semiconductor Advanced Flip Chip Packaging
Independently Published
The Semiconductor Manufacturing Handbook: Fabrication Processes, Equipment, Materials, Packaging, Testing, and Advanced Chip Technologies
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